Optoelectronic package structure and process for planar passive optical and optoelectronic devices

ABSTRACT

An optical-electronic package for an electronic device provides electrical connections to the electronic device and optical fiber connections to the electronic device. The package includes a high thermal conductivity base which has a pedestal to support and provide heat transfer connection to the electronic device. A seal band is formed on the base and a casing is bonded to the seal band. The casing has side feedthroughs for the electrical connections from the electronic device, and the casing has top feedthroughs or grooves for the optical fiber connections from the electronic device. A lid is hermetically sealed to the top of the casing. The lid has retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing. The retractable means for forming a bend in the optical fibers is retractable once the lid is sealed on the casing.

INFORMATION

DETAILED DESCRIPTION OF THE INVENTION

DESCRIPTION OF THE PREFERRED EMBODIMENT

Our invention provides a unique package design that allows us to ensure mechanical integrity of the optically aligned components, provides very good thermal management, provides a way to route multiple fibers in and out of the package without affecting its hermetic nature, provides a means for creating an S-bend in the fiber during the assembly operation to reduce the strain in the fiber, provides multiple ways to make electrical interconnections to suit the subsystem package design.

FIG. 1 shows a perspective, exploded view of elements of an optoelectronic package designed in accordance with this invention for housing an optoelectronic semiconductor chip or device A base BS is provided in the form of a rectangular block with a high degree of thermal conductivity. Centered on the top surface of the base BS is a pedestal PD also in the form of a rectangular block with a high degree of thermal conductivity. The pedestal PD is shorter and narrower than the base BS leaving a margin about the periphery of the base BS. A conventional seal band SB (also known as a seal ring) is formed about the periphery of the top surface of the base BS, forming a rectangular ring about the pedestal PD.

FIGS. 2A-2C are schematic drawings showing vertical sections of a simplified version of the package of FIG. 1 taken along a plane parallel to the X and Z axes in FIG. 1 showing three phases of the sealing process. The optical fibers OF are shown in FIG. 2A before closure of the lid LI of the package with the retractable structures RS contacting the optical fibers OF which are positioned in proper alignment by grooved recesses GR. Note that the optical fibers OF are connected to the semiconductor chip or device DV.

FIG. 2B shows the optical fibers OF with an S-bend therein after closure of lid LI, with the lid LI shown resting on the seal band SB.

FIG. 2C shows the package of FIG. 2B after the retractable structures RS have been retracted to form retracted structures RS′ spaced well above the optical fibers OF to eliminate any stress thereon which would be caused by continued contact with the retractable structures RS.

In FIG. 1, a casing CS with four sidewalls and fiber supports FS on the ends is provided that is located between the base BS and the lid LI. The casing CS is bonded (by means such as brazing or soldering) to the base BS by assembly thereof and fusing or otherwise bonding the seal band SB to casing CS, providing a hermetic seal between the casing CS and the base BS.

The base BS is preferably composed of a high thermal conductivity aluminum nitride (AlN) or silicon carbide (SiC) base. The seal band SB which is fused to the casing CS and the base BS allows one to form a seal therewith by brazing a CTE matching alloy. There are several alloys which are suitable materials for the casing CS, e.g. Ni:Co:Fe/29%:17%:54% alloy such as KOVAR™ (of Carpenter) alloy available from the Ed Fagan Company, Franklin Lakes, N.J.; or Ni:Fe/42%:58% “42 Alloy”.

The casing CS has provisions for providing electrically insulated sidewall vias or passageways for electrical interconnections EI as seen in FIG. 1 from the long sides thereof, as will be well understood by those skilled in the art of making hermetically sealed electrical interconnections through conductive structures. The casing CS has provisions for providing passageways for optical fiber(s) OF extending from the narrow sides thereof across the fiber supports FS as seen in FIGS. 2A and 2B. When the lid LI and the casing CS are seam sealed hermetically, the optical fibers OF are sealed hermetically also.

As stated above, the lid LI, which is used for hermetically sealing the package , also has the set of retractable structures RS that cause the formation of an S-bend in the optical fiber(s) OF when the lid LI is assembled onto the casing CS. The retractable structures RS can be retracted by thermal shrinkage (FIG. 2C) or mechanical deflection means once the seam sealing is complete so that the optical fiber(s) OF is/are now free to change the shape of its arc if there is relative motion between the package walls of casing CS, etc. and the central pedestal PD due to thermal gradients. The S-bend in the optical fiber(s) OF thus provides strain relief on the inside of the package .

FIG. 3 shows a portion of a package embodying an alternate structure of the base BS and pad PD wherein the base BS is composed of AlN or similar high thermal conductivity which includes internal wiring so that one can wirebond from a chip to wire bond pads on the base BS or even attach the chip to the wring by using flip-chip technology and second make outside electrical connections EI to the base BS, either as lead-frame or wire bond pads on the side or a pin-array on the bottom. This design flexibility provides a package design suitable to different demands of the subsystem (second level) package.

FIG. 4 is a schematic drawing showing a vertical cross-section of a simplified version of the package of FIG. 1 taken along a plane parallel to the Y and Z axes in FIG. 1 with the modification of connecting wire bonds WB (fly wires) to an electronic device DV (e.g. an optoelectronic chip) resting on the pedestal PD which rests upon the base BS. There are external connection pins EP shown extending through the base BS to provide electrical connections to the wire bonds WB. The casing CS seals to the base BS as in FIGS. and A-C.

FIG. 5 is a modification of the view seen in FIG. 4 wherein the base and the pedestal have been replaced by a high thermal conductivity ceramic body HC with buried conductors BC therein reaching from outside the package to wire bonds WB which connect to the electronic device DV. The sidewalls of the package are indicated schematically by the picture frame elements PF which comprise the equivalent of casing CS. The picture frame would have four sidewalls like casing CS and would be sealed at the top as in FIGS. and A-C.

In summary, flexible elements are provided in the form of retractable structures RS, which are aligned to an already fixed array of optical fibers or even a single fiber OF and used to produce the S-bends therein during the sealing of the lid LI with the retractable structures RS, to the frame on the package . The retractable structures RS are composed of a material which can be shrunk. For example, the retractable structures RS may be composed of porous glass or porous metal formed by powder metallurgy which can be shrunk by application of heat with a laser beam, a local hot wire above the cover or the like.

Alternatively, the retractable structures can be composed of a low melting point material such as a gold-tin alloy which melts at about 280° C. and coalesces into a globule spaced well away from the optical fiber.

As stated above an optoelectronic package has to perform many functions. Many planar optoelectronic devices must be precisely aligned to other optical or optoelectronic components including optical fibers OF. The packages / provide mechanical support to maintain required alignment permanently or for the designed end of life period. The devices dissipate an amount of heat which must be removed efficiently. Optical fibers are routed in and out of the package . Electrical interconnections EI are provided, and in most cases the package is sealed hermetically.

Composition of Retractable Structures

The retractable means is formed of a retractable material which adapted to be withdrawn to retracted position when heated with a focused source of radiation and the retractable material is selected from the group consisting of a porous material and a low melting point alloy which coalesces into a globule in response to application of heat thereto.

While this invention has been described in terms of the above specific embodiment(s), those skilled in the art will recognize that the invention can be practiced with modifications within the spirit and scope of the appended claims, i.e. that changes can be made in form and detail, without departing from the spirit and scope of the invention. Accordingly all such changes come within the purview of the present invention and the invention encompasses the subject matter of the claims which follow.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other aspects and advantages of this invention are explained and described below with reference to the accompanying drawings, in which:

FIG. 1 shows a perspective, exploded view of elements of an optoelectronic package designed in accordance with this invention for housing an optoelectronic semiconductor chip or device

FIGS. 2A-2C are schematic drawings showing vertical sections of a simplified version of the package of FIG. 1 taken along a plane parallel to the X and Z axes in FIG. 1 showing three phases of the sealing process.

FIG. 3 shows a portion of a package embodying an alternate structure of the base and pad.

FIG. 4 is a schematic drawing showing a vertical cross-section of a simplified version of the package of FIG. 1 taken along a plane parallel to the Y and Z axes in FIG. 1 with the modification of connecting wire bonds to an electronic device resting on the pedestal which rests upon the base.

FIG. 5 is a modification of the view seen in FIG. 4 wherein the base and the pedestal have been replaced by a high thermal conductivity ceramic body with buried conductors therein reaching from outside the package to wire bonds which connect to an electronic device.

CLAIMS

1. An optical-electronic package, comprising: at least one active device selected from the group consisting of electronic and optoelectronic devices; electrical connections from the active device; optical fiber connections from the active device; a high thermal conductivity base, the base having a pedestal to support and provide heat transfer connection to the active device; a casing comprising sidewalls bonded to the base; the package having passageways for the electrical connections from the active device, the package having passageways for the optical fiber connections from the active device; a lid hermetically sealed on top of the casing, the lid having retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing, the retractable means for forming a bend in the optical fibers being retractable once the lid is sealed on the casing.

2. The optical-electronic package of claim 1 wherein the pedestal and base have internal electrical connections and contact pads on the surface of the pedestal and base for active device attach or wire bond.

3. The optical-electronic package of claim 1 wherein the retractable means is formed of porous material.

4. The optical-electronic package of claim 1 wherein the retractable means is formed of a retractable material which adapted to be withdrawn to retracted position when heated with a focused source of radiation and the retractable material is selected from the group consisting of a porous material and a low melting point alloy which coalesces into a globule in response to application of heat thereto.

5. The optical-electronic package of claim 1 wherein the package includes fiber supports extending from the sidewalls thereof.

6. The optical-electronic package of claim 1 wherein the package includes fiber supports extending from the sidewalls thereof with grooved recesses therein.

7. The optical-electronic package of claim 1 wherein interconnection lines are formed through the casing to the device.

8. The optical-electronic package of claim 1 wherein interconnection lines are formed through the base to the device.

9. The optical-electronic package of claim 1 wherein the base is formed of a high thermal conductivity ceramic material and interconnection lines are formed through the base to the device.

10. The optical-electronic package of claim 1 wherein the base is a high conductivity structure with internal wiring and pads on the surface of the top surface of the pedestal.

11. An optical-electronic package, comprising: an electronic device formed on an ancillary element selected from the group consisting of a semiconductor chip or substrate; electrical connections from the ancillary element; optical fiber connections from the ancillary element; a high thermal conductivity base, the base having a pedestal to support and provide heat transfer connection to the ancillary element; a seal band bonded to the base; a casing bonded to the seal band by means selected from the group consisting of soldering and brazing providing a hermetic seal thereto, the casing having side feedthroughs for the electrical connections from the ancillary element, and the package having top feedthroughs or grooves for the optical fiber connections from the ancillary element; a lid hermetically sealed on top of the casing, the lid having retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing, the retractable means for forming a bend in the optical fibers being retractable by thermal or mechanical means once the lid is sealed on the casing.

12. The optical-electronic package of claim 11 wherein the pedestal and base have internal electrical connections and contact pads on the surface of the pedestal and base for device attach or wire bond.

13. The optical-electronic package of claim 11 wherein the retractable means is formed of porous material.

14. The optical-electronic package of claim 11 wherein the retractable means is formed of a retractable material which adapted to be withdrawn to retracted position when heated with a focused source of radiation and the retractable material is selected from the group consisting of a porous material and a low melting point alloy which coalesces into a globule in response to application of heat thereto.

15. The optical-electronic package of claim 11 wherein the package includes fiber supports extending from the sidewalls thereof.

16. The optical-electronic package of claim 11 wherein the package includes fiber supports extending from the sidewalls thereof with grooved recesses therein.

17. The optical-electronic package of claim 11 wherein interconnection lines are formed through the casing to the device.

18. The optical-electronic package of claim 11 wherein interconnection lines are formed through the base to the device.

19. The optical-electronic package of claim 11 wherein the base is formed of a high thermal conductivity ceramic material and interconnection lines are formed through the base to the device.

20. The optical-electronic package of claim 11 wherein the base is a high conductivity structure with internal wiring and pads on the surface of the top surface of the pedestal.

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